PRODUCTS

Wafer Robot

上銀科技 HIWIN Wafer Robot
Features

The advantage is on vertical integration of both hardware and software, also using high precision and stiffness DD motor, the repeatability can reach ±0.02mm. Small circling radial and high utilization of space.



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適用於半導體產業(晶圓取放)、光電產業(小型面板、小型太陽能板)、LED產業(藍寶石基板、膠環)等取放設備。